Molybdenum rods are used in a variety of applications in the semiconductor industry, the following are some common application areas:
Silicon wafer production: Molybdenum rods are often used in the production process of silicon wafers. It can be used as a dopant source for preparing P-type or N-type silicon materials. Molybdenum rods achieve the desired electronic properties by controlling the heating and cooling process to achieve the doping and structural adjustment of the silicon wafer.
Line width reduction: In semiconductor processes, molybdenum rods can be used as mask tools for line width reduction. Through photolithography and etching processes, molybdenum rods can be used to make high-precision line width reduction structures to realize the preparation and integration of microelectronic devices.
Thermal management: Semiconductor devices generate a lot of heat during operation, and molybdenum rods can be used as heat dissipation materials or components of heat sinks due to their excellent thermal conductivity. Molybdenum rods can effectively conduct and disperse heat and maintain a stable operating temperature of semiconductor devices.
Vacuum packaging: In the packaging process of semiconductor devices, molybdenum rods can be used as part of vacuum packaging. It can be used as a component material of the packaging cavity, providing good sealing performance and mechanical strength, and protecting the device from the interference of the external environment.
Contact material: Molybdenum rods are often used as contact materials for semiconductor devices. Due to the good electrical conductivity and mechanical strength of molybdenum, it can be used to make components such as electrodes, leads and contact points to achieve reliable connection and signal transmission with other electronic components.
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