Tungsten-rhenium probe is a probe used for semiconductor wafer testing. It is made of tungsten-rhenium alloy material and has the advantages of high strength, high hardness and good corrosion resistance.
In wafer testing, tungsten-rhenium probes are used to contact integrated circuit devices on the wafer to test their electrical characteristics and performance. During testing, the probe is in contact with the contacts on the wafer, and the performance of the integrated circuit is evaluated by measuring parameters such as current and voltage. Unqualified dies will be marked and eliminated in subsequent processes to avoid increasing manufacturing costs.
The manufacturing of tungsten-rhenium probes for wafer testing requires precision machining and surface treatment to ensure high accuracy and reliability. During use, the probe needs to be kept clean and stable to avoid adverse effects on test results.
In short, the wafer testing tungsten-rhenium probe is an important semiconductor testing tool. It can accurately test the performance and reliability of integrated circuits on the wafer, and plays a vital role in ensuring the quality and efficiency of semiconductor manufacturing.
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