A tungsten probe card is a probe card used for wafer testing, usually consisting of a tungsten probe and a test circuit board. The function of the tungsten probe card is to directly contact the tip of the tungsten probe with the pad of the wafer under test, thereby testing the electrical properties of the wafer. During the test, when the tungsten probe needle contacts the wafer pad, the platform of the probe card will rise to a standard height, leaving a mark on the wafer pad. Because tungsten needles are tapered, as they wear through multiple tests, the diameter of the needle becomes larger and larger. Conventionally, it is required that when the needle of the tungsten detection needle is inserted into the wafer liner, the contact area cannot exceed one quarter of the wafer liner.
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