Characteristics of Straight Tungsten Needles for Wafer Testing

Straight tungsten needles for wafer testing have the following characteristics:

1. High rigidity: Due to the use of tungsten material, the wafer testing straight tungsten needle has high rigidity and stability, which can maintain the stability and accuracy of the probe during the testing process.

2. High conductivity: After surface treatment such as polishing and gold plating, the wafer testing straight tungsten needle has excellent conductivity, which can ensure the accuracy and stability of the test.

3. Long life: Due to the use of high-purity tungsten material and precise micro-machining technology, the wafer testing straight tungsten needle has a long service life and can be used multiple times.

4. Wide range of application: Straight tungsten needles for wafer testing are suitable for testing integrated circuit wafers of various sizes and types, and have a wide range of applications.

More details of tungsten needles, please visit website: http://tungsten.com.cn/tungsten-needles-and-pins.html

Please contact CHINATUNGSTEN for inquiry and order of tungsten needles:

Email: sales@chinatungsten.com

Tel.: +86 592 5129595

0