There are many types of tungsten probes for wafer testing, and the choice often depends on the specific test needs and application. The following are some common types:
1. Tapered Probe: This type of probe has a tapered tip and is suitable for testing applications that require small area contact. Tapered probes are typically used on high-density wafers.
2. Spherical probe: The tip of the probe is spherical, providing a relatively large contact area. Spherical probes are suitable for some test applications where contact area requirements are not so critical.
3. Sharp Probe: This type of probe has a very sharp tip and is often used for high-precision testing that requires very small contact points, such as in the field of microelectronics.
4. Graduated Probes: These probes have tiny graduations or markings on the tip that are used to measure or locate specific test points.
5. Sharpened probe: It has a specially processed sharpened tip to improve the sharpness of the probe and reduce wear.
6. Automatic test probe: The probe designed for the automatic test system has the characteristics of adapting to the automated test process.
7. High temperature test probe: Probe specially designed for testing in high temperature environment.
8. Multi-channel probe: Equipped with multiple probe channels, it can test multiple test points or multiple wafers at the same time.
9. Specially shaped probes: Specially shaped probes designed according to specific testing requirements.
These types of wafer test tungsten probes can be selected based on the test application. When selecting probes, factors such as test accuracy, contact area, environmental conditions, and automation requirements need to be considered. It’s best to refer to the manufacturer’s spec sheet and recommendations when purchasing.
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