The tapered wafer testing tungsten probe is a probe used for wafer testing with a tapered tip. This type of probe is typically used on high-density wafers where the distance between test points is very small and a small area of contact is required. The tapered tip design facilitates precise and efficient electrical connections to tiny test points.
Some features and application areas include:
1. Small area contact: The tip design of the tapered probe enables it to make electrical connection with the test point in a very small area. This is important for tiny circuit components on high-density wafers.
2. High-precision testing: Conical probes are often used in applications that require high-precision testing, such as in the field of microelectronics. Its sharp tip helps make accurate electrical connections.
3. Suitable for small-size wafers: The tapered wafer test tungsten probe is suitable for small-size wafers where the distance between test points is very close.
4. High-density testing: Due to the design of the tapered probe, it can accommodate high-density test layouts while maintaining a small contact area.
5. Microelectronics applications: Tapered wafer test tungsten probes are often used in the field of microelectronics to test tiny circuits on integrated circuit chips.
When selecting wafer test probes, you need to consider the specific test requirements and the design of the circuit on the wafer to ensure that the selected probe can meet the test accuracy and performance requirements.
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