The spherical wafer testing tungsten probe is a probe used for wafer testing with a spherical tip. Compared to tapered probes, ball probes have larger tips, providing a relatively larger contact area. This design makes the ball probe suitable for some test applications where contact area is not so critical.
Some features and application areas include:
1. Relatively large contact area: The tip design of the spherical probe enables it to provide a relatively large contact area, which is suitable for some test applications that require low contact point area.
2. Suitable for general testing needs: Spherical wafer testing tungsten probes are usually used for general wafer testing, where the distance between test points is large and the requirements for high-precision small-area contact are not very high.
3. Reduce loss: Since the tip of the spherical probe is larger, it may be more wear-resistant to a certain extent than the tapered probe, which can reduce the impact of wear on the shape of the probe.
4. Suitable for general size wafers: The spherical wafer testing tungsten probe is suitable for general size wafers, in which the distance between test points is relatively large.
5. Automated testing: Due to their relatively large tips, ball probes may be more easily adapted to the requirements of automated test systems.
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