Tungsten probe for high-temperature testing is a probe specially designed for testing in high-temperature environments. This type of probe typically maintains stable performance over a higher temperature range and is suitable for wafer testing that requires high temperature conditions. Such testing may involve measurements of electrical properties, material properties, etc. in high-temperature environments.
Some features and application areas include:
1. High-temperature stability: The tungsten probe for wafer high-temperature testing has good high-temperature stability and can maintain performance in high-temperature environments to ensure the accuracy of test results.
2. High-temperature electrical tests: These probes are suitable for electrical tests that need to be performed under high-temperature conditions, such as testing the conductivity, capacitance and other characteristics of materials at high temperatures.
3. Chip testing in high-temperature environments: In the semiconductor industry, wafer high-temperature testing tungsten probes can be used to test the electrical properties of chips in high-temperature environments to ensure the stability of the chips under high-temperature conditions.
4. Thermal performance testing: For some applications that require testing of thermal properties of materials under high temperature conditions, these probes may be used to measure parameters such as thermal conductivity and thermal expansion.
5. High-temperature automated testing: In environments that require high-temperature automated testing, this type of probe can adapt to the automatic testing system and improve testing efficiency.
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