Tungsten probe tip for wafer high-temperature testing is a probe specially designed for testing in high-temperature environments. This type of probe tip typically maintains stable performance over a higher temperature range and is suitable for wafer testing that requires high temperature conditions. Such testing may involve measurements of electrical properties, material properties, etc. in high-temperature environments.
Some features and application areas include:
1. High-temperature stability: The tungsten probe tip has good high-temperature stability and can maintain performance in high-temperature environments to ensure the accuracy of test results.
2. High-temperature electrical tests: These probe tips are suitable for electrical tests that need to be performed under high-temperature conditions, such as testing the conductivity, capacitance and other characteristics of materials at high temperatures.
3. Chip testing in high-temperature environments: In the semiconductor industry, tungsten probe tips can be used to test the electrical properties of chips in high-temperature environments to ensure the stability of the chips under high-temperature conditions.
4. Thermal performance testing: For some applications that require testing the thermal properties of materials under high temperature conditions, these probe tips may be used to measure parameters such as thermal conductivity and thermal expansion.
5. High-temperature automated testing: In environments that require high-temperature automated testing, this type of probe can adapt to the automatic testing system and improve testing efficiency.
More details of tungsten probes, please visit website: http://tungsten.com.cn/tungsten-needles-and-pins.html
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