IC chip microneedle wafer probe is a probe used to test IC chips and wafers with high precision and stability. It is usually made of tungsten steel, has a small tip and good wear resistance, and can meet high-precision testing requirements.
The manufacture of IC chip microneedle wafer probes requires multiple processes, including material selection, grinding, polishing, heat treatment, etc. During the grinding and polishing process, precise equipment and processes are required to ensure the high precision and high finish of the probe. In addition, in order to improve the strength and corrosion resistance of the probe, a special heat treatment process is required.
IC chip microneedle wafer probes are used in a wide range of applications, including semiconductor manufacturing, chip packaging, wafer testing, etc. In these fields, IC chip microneedle wafer probes can be used to test the performance and reliability of the chip, as well as perform various precision operations and processing. Due to its high precision and stability, IC chip microneedle wafer probe has become one of the indispensable and important tools in many fields.
In short, the IC chip microneedle wafer probe is a high-precision and highly stable probe that is widely used in various fields. Its manufacturing requires multiple processes, including material selection, grinding, polishing, heat treatment, etc. The selection and use need to be based on actual needs.
More details of tungsten probes, please visit website: http://tungsten.com.cn/tungsten-needles-and-pins.html
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