High-density tungsten alloy silver-plated packaging sheet is a product used to package electronic components. It is made of high-density tungsten alloy and is plated with a layer of silver on its surface. This kind of packaging sheet has high thermal conductivity and high electrical conductivity, can effectively conduct the heat generated by electronic components, and has good electromagnetic shielding performance.
Tungsten alloy silver-plated packaging sheets can be processed into various shapes and sizes to meet the packaging needs of different electronic components. It has a wide range of applications and can be used in consumer electronics, communication equipment, automotive electronics and other fields.
- High thermal conductivity: Tungsten alloy has a high thermal conductivity and can quickly conduct the heat generated by electronic components out, thus ensuring the normal operation of electronic components.
- High strength: Tungsten alloy has high tensile strength and compressive strength, can withstand large mechanical loads, and ensures the stability and reliability of the packaging chip.
- Good electromagnetic shielding performance: The silver-plated layer has good electromagnetic shielding performance and can effectively reduce the impact of electromagnetic interference and radiation on electronic components.
- Easy to process: Tungsten alloy has good processing performance and can be used to realize packaging chips of various shapes and sizes through cutting, drilling, turning and other processing processes.
In short, high-density tungsten alloy silver-plated packaging sheet is a high-performance, high-reliability packaging material that can meet the packaging needs of various electronic components.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
