High-density tungsten alloy gold-plated packaging sheet is a product used to package electronic components. It is made of high-density tungsten alloy and is plated with a layer of gold on its surface. This kind of packaging sheet has excellent electrical conductivity, oxidation resistance and good ductility, can effectively conduct the heat generated by electronic components, and can ensure the normal operation of electronic components.
The advantages of high-density tungsten alloy gold-plated packaging chips include:
- Excellent electrical conductivity: Gold is an excellent conductor with good electrical conductivity, which can ensure the quality and stability of signal transmission.
- Anti-oxidation performance: Gold is not easily oxidized at room temperature, which can ensure the long-term stability and reliability of the packaging chip.
- Good ductility: Gold has good ductility and can be closely combined with the tungsten alloy substrate to form a dense metal layer to improve the mechanical properties and sealing performance of the packaging sheet.
- Multiple uses: High-density tungsten alloy gold-plated packaging sheets can be used in various fields, such as electronics, communications, aerospace, etc., to meet various packaging needs.
In short, high-density tungsten alloy gold-plated packaging sheet is a high-performance, high-reliability packaging material that can meet the packaging needs of various electronic components.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
