Tungsten alloy coated packaging chip is a packaging chip that uses tungsten alloy as the base material and is coated with other metal or non-metallic materials on the surface. This kind of packaging sheet usually has the characteristics of high thermal conductivity, high electrical conductivity, high strength, and good electromagnetic shielding performance. It is widely used in component packaging in electronics, communications, aerospace and other fields.
The manufacturing process of tungsten alloy coated packaging chips usually includes the following steps:
- Substrate preparation: Use tungsten alloy as the substrate and perform necessary processing and treatment to make it meet the requirements for subsequent coating preparation.
- Surface treatment: Surface treatment is performed on the tungsten alloy substrate, such as grinding, cleaning, etc., to improve the surface roughness and cleanliness of the substrate, which is beneficial to the adhesion and stability of the coating.
- Coating preparation: Coat one or more layers of other metal or non-metal materials, such as gold, silver, copper, nickel, etc., on the surface of the tungsten alloy substrate to form the required coating. The thickness and composition of the coating can be adjusted to specific needs.
- Post-processing: Necessary post-processing is performed on the coating, such as heat treatment, polishing, etc., to improve the performance and appearance quality of the coating.
The advantages of tungsten alloy coated packaging chips include:
- High thermal conductivity: Tungsten alloy has a high thermal conductivity, which can quickly conduct the heat generated by electronic components out and reduce the operating temperature of electronic components.
- High strength: Tungsten alloy has high tensile strength and compressive strength, can withstand large mechanical loads, and ensures the stability and reliability of the packaging chip.
- Good electromagnetic shielding performance: The metal material in the coating has good electromagnetic shielding performance, which can effectively reduce the impact of electromagnetic interference and radiation on electronic components.
- Good adhesion and stability: The coating is closely combined with the tungsten alloy substrate, is not easy to fall off or deform, and has good stability and durability.
- Easy to process: Tungsten alloy has good processing performance and can be used to realize packaging chips of various shapes and sizes through cutting, drilling, turning and other processing processes.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
