Tungsten alloy single-layer packaging sheet is a packaging sheet made of pure tungsten or tungsten alloy. This kind of packaging sheet has the characteristics of high thermal conductivity, high strength, and good corrosion resistance, and is widely used in component packaging in electronics, communications, aerospace and other fields.
The manufacturing process of tungsten alloy single-layer packaging chips usually includes the following steps:
- Raw material preparation: Select appropriate tungsten or tungsten alloy as raw material, and perform necessary processing and processing, such as cutting, grinding, etc., to make it meet the requirements of subsequent processing.
- Heat treatment: Heat treatment is performed on tungsten alloy to eliminate internal stress and improve its mechanical properties and stability.
- Surface treatment: Surface treatment of tungsten alloy, such as grinding, polishing, etc., to improve its surface roughness and cleanliness, which is beneficial to improving the adhesion and stability of the packaging chip.
- Processing and forming: The processed tungsten alloy is processed and formed, such as cutting, drilling, turning, etc., to form the required shape and size of the packaging chip.
- Inspection and packaging: Conduct quality inspection on the processed tungsten alloy packaging chips, such as size, flatness, hardness, etc., and package them after passing the test.
The advantages of tungsten alloy single-layer encapsulation sheets include:
- High thermal conductivity: Tungsten alloy has a high thermal conductivity, which can quickly conduct the heat generated by electronic components out and reduce the operating temperature of electronic components.
- High strength: Tungsten alloy has high tensile strength and compressive strength, can withstand large mechanical loads, and ensures the stability and reliability of the packaging chip.
- Good corrosion resistance: Tungsten alloy is not easily oxidized and corroded, and can ensure the long-term stability and reliability of the packaging chip.
- Good adhesion and stability: The tungsten alloy packaging sheet is closely integrated with the electronic components, is not easy to fall off or deform, and has good stability and durability.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
