Tungsten alloy single-layer encapsulation sheet is suitable for the following occasions:
- High-temperature environment: Since tungsten alloy has a high melting point and hardness and can maintain its mechanical properties and stability in high-temperature environments, tungsten alloy single-layer packaging sheets are suitable for component packaging in high-temperature environments.
- High-speed cutting and processing: Tungsten alloy single-layer encapsulation sheet has high hardness and good wear resistance, and is suitable for occasions requiring high-speed cutting and processing.
- Where high thermal conductivity is required: Tungsten alloy has high thermal conductivity and can quickly conduct heat generated by electronic components and reduce the operating temperature of electronic components. Therefore, it is suitable for occasions where high thermal conductivity is required.
- Where high strength is required: Tungsten alloy single-layer encapsulation sheets have high strength and good corrosion resistance, and are suitable for occasions where large mechanical loads or harsh environments are required.
- Where electromagnetic shielding is required: Tungsten alloy single-layer packaging sheets can be used as electromagnetic shielding materials, which can effectively reduce the impact of electromagnetic interference and radiation on electronic components.
It should be noted that due to the high price of tungsten alloy and the difficulty in manufacturing, other materials can also be used as packaging materials instead of tungsten alloy in some non-critical occasions.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
