Tungsten alloy multi-layer packaging chip is a packaging chip that adopts a multi-layer structure and uses tungsten alloy as the main material. This kind of packaging sheet has the characteristics of high thermal conductivity, high strength, and good electromagnetic shielding performance, and is widely used in component packaging in electronics, communications, aerospace and other fields.
The manufacturing process of tungsten alloy multi-layer packaging chips usually includes the following steps:
- Raw material preparation: Select appropriate tungsten or tungsten alloy as the main material, and perform necessary processing and processing, such as cutting, grinding, etc., to make it meet the requirements of subsequent processing.
- Layer-up processing: stack multiple pieces of tungsten alloy materials together and perform necessary processing, such as welding, riveting, etc., to form a multi-layer structure.
- Heat treatment: Heat treatment is performed on the multi-layered tungsten alloy to eliminate internal stress and improve its mechanical properties and stability.
- Surface treatment: Surface treatment is performed on the multi-layered tungsten alloy, such as grinding, polishing, etc., to improve its surface roughness and cleanliness, which is beneficial to improving the adhesion and stability of the packaging chip.
- Processing and forming: The processed multi-layered tungsten alloy is processed and formed, such as cutting, drilling, turning, etc., to form the required shape and size of the packaging chip.
- Inspection and packaging: Carry out quality inspection on the processed tungsten alloy multi-layer packaging chips, such as size, flatness, hardness, etc., and package them after passing the test.
The advantages of tungsten alloy multi-layer packaging chips include:
- High thermal conductivity: Tungsten alloy has a high thermal conductivity, and the multi-layer structure can better conduct the heat generated by electronic components and reduce the operating temperature of electronic components.
- High strength: Tungsten alloy has high tensile strength and compressive strength, and the multi-layer structure can further improve the mechanical strength and stability of the packaging chip.
- Good electromagnetic shielding performance: Tungsten alloy has good electromagnetic shielding performance, and the multi-layer structure can better shield the effects of electromagnetic interference and radiation on electronic components.
- Good adhesion and stability: The multi-layered tungsten alloy packaging sheet is closely integrated with electronic components and is not easy to fall off or deform, and has good stability and durability.
- Strong customizability: Tungsten alloy multi-layer packaging chips of different specifications and shapes can be customized according to specific needs to meet various packaging needs.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
