Tungsten alloy sandwich structure packaging sheet is a special packaging sheet. Its structure uses tungsten alloy as a sandwich material and is wrapped by two layers of metal materials (such as copper, nickel, etc.) on the upper and lower layers to form a three-layer structure. This kind of packaging sheet is usually used in high-strength, high-thermal conductivity and high-reliability applications, such as aerospace, military, power electronics and other fields.
The manufacturing process of tungsten alloy sandwich structure packaging chips is relatively complex and generally includes the following steps:
- Preparation of tungsten alloy sandwich material: Process the tungsten alloy into the required shape and size as the sandwich material.
- Metal layer preparation: Select appropriate metal materials (such as copper, nickel, etc.) and process them to form upper and lower metal coating layers.
- Heat treatment and welding: The metal layer is welded to the tungsten alloy sandwich material and heat treated to eliminate internal stress and improve mechanical properties.
- Processing and shaping: Process and shape the welded three-layer structure to form the required shape and size of the packaging chip.
- Inspection and packaging: Conduct quality inspection on the processed tungsten alloy sandwich structure packaging pieces, such as size, flatness, hardness, etc., and package them after passing the test.
The characteristics of tungsten alloy sandwich structure packaging include:
- High strength: Tungsten alloy has high strength and hardness and can withstand large mechanical loads and harsh environments.
- High thermal conductivity: Tungsten alloy has high thermal conductivity, which can quickly conduct heat generated by electronic components and reduce the operating temperature of electronic components.
- Good electromagnetic shielding performance: The upper and lower layers of metal materials have good electromagnetic shielding performance, which can effectively reduce the impact of electromagnetic interference and radiation on electronic components.
- High reliability and stability: The tungsten alloy sandwich structure packaging chip has high reliability and stability, and can maintain its performance and stability under harsh environmental conditions.
- Strong customizability: Tungsten alloy sandwich structure packaging sheets of different specifications and shapes can be customized according to specific needs to meet various packaging needs.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
