What Are Applications of Tungsten Alloy Sandwich Structure Packaging Sheets?

Tungsten alloy sandwich structure packaging chips are mainly used in the following fields:

  1. Aerospace field: Because the tungsten alloy sandwich structure packaging sheet has high strength, high thermal conductivity and good electromagnetic shielding performance, it is suitable for electronic component packaging in the aerospace field, such as control circuit boards, sensors, etc.
  2. Military field: In the military field, tungsten alloy sandwich structure packaging sheets can be used to package military electronic equipment, such as radars, communication equipment, etc., to cope with harsh environmental conditions and ensure the stable operation of the equipment.
  3. Automotive electronics field: In the automotive electronics field, tungsten alloy sandwich structure packaging sheets can be used to package electronic components in automobiles, such as engine control modules, ABS systems, etc., to improve their reliability and durability.
  4. Power electronics field: In the power electronics field, tungsten alloy sandwich structure packaging sheets can be used to package power electronic devices, such as rectifiers, inverters, etc., to improve their heat dissipation performance and reliability.
  5. Communication field: In the communication field, tungsten alloy sandwich structure packaging sheets can be used to package electronic components in communication equipment, such as routers, switches, etc., to improve their stability and reliability.
  6. Medical device field: In the medical device field, tungsten alloy sandwich structure packaging sheets can be used to package electronic components in medical equipment, such as electrocardiographs, ultrasonic diagnostic machines, etc., to improve their stability and reliability.

In summary, tungsten alloy sandwich structure packaging sheets have the characteristics of high strength, high thermal conductivity and good electromagnetic shielding performance, and are widely used in component packaging in electronics, communications, aerospace and other fields.

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