The characteristics and advantages of tungsten alloy sandwich structure packaging chips mainly include the following aspects:
- High strength and reliability: The tungsten alloy sandwich structure packaging chip uses tungsten alloy as the sandwich material, which has high strength and hardness and can withstand large mechanical loads and harsh environments, improving the reliability and stability of the packaging chip.
- High thermal conductivity: Tungsten alloy has high thermal conductivity, which can quickly conduct heat generated by electronic components, reduce the operating temperature of electronic components, and improve the stability and reliability of electronic equipment.
- Good electromagnetic shielding performance: The tungsten alloy sandwich structure packaging sheet uses two layers of metal materials as the upper and lower layers as the wrapping layer. It has good electromagnetic shielding performance and can effectively reduce the impact of electromagnetic interference and radiation on electronic components.
- Strong customizability: Tungsten alloy sandwich structure packaging sheets of different specifications and shapes can be customized according to specific needs to meet various packaging needs.
- Excellent adhesion and stability: The tungsten alloy sandwich structure packaging sheet is closely combined with the electronic components, is not easy to fall off or deform, and has good stability and durability.
- Corrosion resistance and oxidation resistance: Tungsten alloy is not easily oxidized and corroded, and can maintain its performance and stability under harsh environmental conditions.
- Good processing performance: Tungsten alloy has good processing performance and can be used to realize packaging chips of various shapes and sizes through cutting, drilling, turning and other processing processes.
In summary, tungsten alloy sandwich structure packaging sheets have the characteristics and advantages of high strength, high thermal conductivity, and good electromagnetic shielding performance, and are widely used in component packaging in electronics, communications, aerospace and other fields.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
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