Tungsten alloy communication electronic packaging sheet is a communication electronic component packaging sheet made of tungsten alloy material. This kind of packaging sheet has the characteristics of high thermal conductivity, high strength, and good electromagnetic shielding performance, and is widely used in electronic component packaging in the communication field.
The manufacturing process of tungsten alloy communication electronic packaging chips usually includes the following steps:
- Raw material preparation: Select appropriate tungsten or tungsten alloy as the main material, and perform necessary processing and processing, such as cutting, grinding, etc., to make it meet the requirements of subsequent processing.
- Processing and forming: The processed tungsten alloy is processed and formed, such as cutting, drilling, turning, etc., to form the required shape and size of the packaging chip.
- Surface treatment: Surface treatment is performed on the processed tungsten alloy packaging chip, such as grinding, polishing, etc., to improve its surface roughness and cleanliness, which is beneficial to improving the adhesion and stability of the packaging chip.
- Heat treatment: Heat treatment is performed on the tungsten alloy packaging chip to eliminate internal stress and improve its mechanical properties and stability.
- Inspection and packaging: Conduct quality inspection on the processed tungsten alloy communication electronic packaging chips, such as size, flatness, hardness, etc., and package them after passing the test.
The characteristics of tungsten alloy communication electronic packaging sheets include:
- High thermal conductivity: Tungsten alloy has high thermal conductivity, which can quickly conduct the heat generated by electronic components out and reduce the operating temperature of electronic components.
- High strength: Tungsten alloy has high strength and hardness and can withstand large mechanical loads and harsh environments.
- Good electromagnetic shielding performance: Tungsten alloy has good electromagnetic shielding performance and can effectively reduce the impact of electromagnetic interference and radiation on electronic components.
- Good adhesion and stability: Tungsten alloy communication electronic packaging sheets are closely combined with electronic components, are not easy to fall off or deform, and have good stability and durability.
- Strong customizability: Tungsten alloy communication electronic packaging sheets of different specifications and shapes can be customized according to specific needs to meet various packaging needs.
In summary, tungsten alloy communication electronic packaging sheets have the characteristics of high thermal conductivity, high strength, and good electromagnetic shielding performance, and are widely used in electronic component packaging in the communication field.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
