Tungsten alloy aerospace packaging chip is a kind of aerospace electronic component packaging chip made of tungsten alloy material. Because tungsten alloy has high strength, high thermal conductivity, high temperature resistance and corrosion resistance, this kind of packaging sheet can meet the special requirements for electronic components in the aerospace field and ensure the stability and reliability of electronic components in extreme environments.
The manufacturing process of tungsten alloy aerospace packaging chips usually includes the following steps:
- Raw material preparation: Select appropriate tungsten or tungsten alloy as the main material, and perform necessary processing and processing, such as cutting, grinding, etc., to make it meet the requirements of subsequent processing.
- Processing and forming: The processed tungsten alloy is processed and formed, such as cutting, drilling, turning, etc., to form the required shape and size of the packaging chip.
- Surface treatment: Surface treatment is performed on the processed tungsten alloy packaging chip, such as grinding, polishing, etc., to improve its surface roughness and cleanliness, which is beneficial to improving the adhesion and stability of the packaging chip.
- Heat treatment: Heat treatment is performed on the tungsten alloy packaging chip to eliminate internal stress and improve its mechanical properties and stability.
- Inspection and packaging: Conduct quality inspection on the processed tungsten alloy aerospace packaging chips, such as size, flatness, hardness, etc., and package them after passing the test.
The characteristics of tungsten alloy aerospace packaging include:
- High strength and reliability: Tungsten alloy has high strength and hardness and can withstand large mechanical loads and harsh environments, ensuring the reliability and stability of the packaging chip.
- High thermal conductivity: Tungsten alloy has high thermal conductivity, which can quickly conduct heat generated by electronic components, reduce the operating temperature of electronic components, and improve the stability and reliability of electronic equipment.
- High temperature resistance and corrosion resistance: Tungsten alloy has a high melting point and can maintain its performance and stability at high temperatures. It also has good corrosion resistance and is suitable for various harsh environments in the aerospace field.
- Good electromagnetic shielding performance: Tungsten alloy has good electromagnetic shielding performance and can effectively reduce the impact of electromagnetic interference and radiation on electronic components.
- Strong customizability: Tungsten alloy aerospace packaging chips of different specifications and shapes can be customized according to specific needs to meet various packaging needs.
In summary, tungsten alloy aerospace packaging sheets have the characteristics of high strength, high thermal conductivity, high temperature resistance and corrosion resistance, and are widely used in electronic component packaging in the aerospace field.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
