Due to the above-mentioned excellent characteristics of copper tungsten heat sink, it has been widely used in the field of electronic component packaging. Especially in occasions where high thermal conductivity and good electrical properties are required, such as high-power electronic devices, microwave devices, lasers, etc. In addition, in high-end fields such as aerospace and national defense, the performance and reliability requirements of electronic components are extremely high, and tungsten-copper alloy package heat sink materials also play an important role. For example, in the aerospace field, electronic components need to work under extreme temperature and pressure conditions, and tungsten-copper alloy package heat sink materials can provide excellent thermal management and electrical connection performance to ensure the normal operation of electronic components.
CuW heat sink is an electronic component packaging material with excellent performance. It combines the high thermal conductivity of tungsten and the high electrical conductivity of copper, and has the advantages of high thermal conductivity, high electrical conductivity, high strength and good corrosion resistance. In the field of electronic component packaging, tungsten-copper alloy package heat sink materials play an irreplaceable role. With the continuous development of science and technology, the application prospects of tungsten-copper alloy package heat sink materials will be broader.
More details of Tungsten Copper Heat Sinks, please visit website: http://tungsten-copper.com/Tungsten-Copper-Heat-Sink.html
Please contact CHINATUNGSTEN ONLINE for inquiry and order of tungsten needles:
Email: sales@chinatungsten.com
Tel.: +86 592 5129595
