CuW base plate is a composite material composed of tungsten and copper, mainly used for the encapsulation of electronic equipment. It has high thermal conductivity, high electrical conductivity, high strength and good toughness, and can quickly conduct the heat generated by electronic components while meeting the electrical connection requirements of electronic components. CuW base plate also has good corrosion resistance and oxidation resistance, and can be used for a long time in harsh environments without damage. In addition, CuW base plate is also easy to process and manufacture. It can be manufactured by powder metallurgy process, and the shape and size can also be precisely controlled by processing and manufacturing process. Therefore, CuW base plate has broad application prospects and market potential in the field of electronic component packaging.
More details of Tungsten Copper Heat Sinks, please visit website: http://tungsten-copper.com/Tungsten-Copper-Heat-Sink.html
Please contact CHINATUNGSTEN ONLINE for inquiry and order of tungsten needles:
Email: sales@chinatungsten.com
Tel.: +86 592 5129595
