Gold-plated tungsten-rhenium probe needles are a high-precision, high-stability and high-reliability test tool that is widely used in semiconductor testing, wafer testing, PCB testing and other fields. Its structure is mainly composed of a probe needle, a probe rod, a connecting wire and a probe interface. The surface is coated with a layer of metal gold or other metal film, which has good conductivity and corrosion resistance. Gold-plated tungsten-rhenium probe needles have the advantages of high precision, high stability and high reliability, but they also have disadvantages such as high cost, regular maintenance, high operating requirements, signal transmission is affected by the environment, the coating is easily damaged, the manufacturing process is complex and there are restrictions on the test frequency. Users need to select the appropriate gold-plated tungsten-rhenium probe according to the specific application scenario and needs, and use and maintain it correctly according to the operating specifications.
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