What Are the Types of Wafer Tungsten Rhenium Probe Cards?

According to different classification standards, wafer tungsten rhenium probe cards can be divided into different types. The following are several common types of wafer tungsten rhenium probe cards:

1. Classification by purpose:
o Chip test probe card: used to test chip performance and quality, including DC test, AC test, functional test, etc.
o Wafer detection probe card: used to detect defects and problems on the surface of the wafer, including appearance inspection, film thickness inspection, etc.
o Failure analysis probe card: used to analyze the cause of chip failure, including electrical test, mechanical test, etc.

2. Classification by probe type:
o Needle tip probe card: has a slender needle tip for contacting the pads or bumps on the chip.
o Blade probe card: has a blade-shaped contact surface for contacting the pads or bumps on the chip.
o Press-fit probe card: has a retractable probe that contacts the pads or bumps on the chip by pressing.

3. Classification by interface type:
o IEEE 488 interface probe card: Use IEEE 488 standard interface to connect with test instruments, with high transmission speed and stability.
o USB interface probe card: Use USB interface to connect with test instruments, with convenient and easy-to-use features.
o LAN interface probe card: Use LAN interface to connect with test instruments, suitable for long-distance testing and large-scale data transmission.

4. Classification by manufacturing materials:
o Tungsten probe card: Use tungsten material to make probes, with high hardness, high wear resistance and high corrosion resistance.
o Alloy probe card: Use alloy material to make probes, with good mechanical properties and corrosion resistance.
o Other material probe cards: Use other materials to make probes, such as silicon carbide, with special physical and chemical properties.

It should be noted that different types of wafer tungsten rhenium probe cards may have different characteristics and applicable scopes, and users should choose the appropriate type according to specific needs. At the same time, with the continuous advancement of technology and the diversified development of application needs, new types of wafer tungsten rhenium probe cards will continue to emerge.

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