In chip testing, the wafer tungsten rhenium probe card plays an important role. It is a high-precision, high-reliability test tool, mainly used before the IC is packaged. By contacting the probe on the probe card with the pad or bump on the chip, the chip signal is received and defective products are screened out. Specifically, the role of the wafer tungsten rhenium probe card in chip testing includes:
1. Connecting test instruments: The wafer tungsten rhenium probe card is used as the “hand” of the test machine. It is connected to the test instrument through the interface to realize the transmission and control of the test signal.
2. Simulating the working state of the chip: By contacting the probe on the probe card with the pad or bump on the chip, the signal transmission and response of the chip in the actual working state can be simulated, thereby detecting the function and performance of the chip.
3. Detecting chip defects: The wafer tungsten rhenium probe card can detect defects and problems in the chip manufacturing process, such as pad defects, bad bumps, etc., to help timely discover and solve problems and improve chip yield.
4. Control the test process: Through the control system and self-diagnosis function on the wafer tungsten-rhenium probe card, precise control of the test process and fault warning can be achieved, improving test efficiency and accuracy.
In short, the wafer tungsten-rhenium probe card plays an important role in connecting test instruments, simulating chip working status, detecting chip defects and controlling the test process in chip testing. It is a key link to ensure chip quality and performance.
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