The thermal conductivity of the tungsten copper probe is mainly achieved through the interaction between the metal bonds and free electrons inside the tungsten copper alloy. The metal bond is a quantum mechanical interaction that enables metal atoms to form a stable crystal structure and transfer heat energy. Free electrons are a special particle in metals that can flow freely in metal crystals to form a carrier that can transfer heat energy.
When the tungsten copper probe receives heat, the heat will intensify the atomic vibrations inside the tungsten copper alloy, and the vibrations of these atoms will be transferred to adjacent atoms through the metal bonds to form a heat flow. At the same time, free electrons will also flow freely in the metal crystal to form an electric current and further transfer heat energy.
Because the tungsten copper alloy has high electrical and thermal conductivity, the tungsten copper probe can quickly transfer heat energy. This excellent thermal conductivity enables the tungsten copper probe to maintain stable performance in high temperature environments and is widely used in high-energy physics experiments, astronomy and other fields.
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