The technical barriers of cut-resistant tungsten wire are relatively high, which are mainly reflected in the following aspects:
- Material preparation and processing difficulty
Inherent characteristics of tungsten metal: Tungsten is an extremely hard and brittle metal that is difficult to process. When cutting or drilling, cracks or breaks often occur due to its inherent brittleness. In addition, tungsten has a high melting point and is not easy to plasticize. It requires a high processing force and increases the wear of cutting tools.
Preparation of high-quality tungsten wire: The production of cut-resistant tungsten wire requires high-purity tungsten metal as raw material, and the tungsten wire is required to have a uniform composition, fine grain structure and good mechanical properties. These requirements increase the difficulty of preparing high-quality tungsten wire.
- Optimization of cutting performance
Cutting efficiency and precision: Cutting-resistant tungsten wire needs to have efficient cutting ability and high-precision cutting effect. This requires the tungsten wire to have suitable performance parameters such as diameter, tensile strength, breaking force and toughness to ensure that the cutting speed can be maintained stable and efficient during the cutting process, while ensuring the flatness and finish of the cutting surface.
Reduce crystal cracking: Crystal cracking is one of the common problems in the tungsten wire cutting process, mainly caused by excessive residual stress of tungsten wire cutting. The crystal cracking problem not only affects the A-grade rate of silicon wafers, but also increases production costs. Therefore, solving the crystal cracking problem is one of the keys to improving the technical barriers of cutting-resistant tungsten wire.
- Technological innovation and R&D investment
New processes and new technologies: In order to improve the performance of cutting-resistant tungsten wire, new processes and new technologies need to be continuously developed. For example, by improving the electroplating process, optimizing the alloy composition, adjusting the drawing process parameters, etc., the strength and toughness of the tungsten wire can be improved, and the occurrence of crystal cracking problems can be reduced.
R&D investment and cost control: Technological innovation and R&D investment require a lot of financial and resource support. At the same time, in order to maintain competitiveness in the fiercely competitive market, enterprises also need to continuously reduce production costs and improve production efficiency. These have put forward higher requirements on the technical barriers of cut-resistant tungsten wire.
- Market access and certification
Market access threshold: The cut-resistant tungsten wire market has a certain access threshold. Enterprises need to have corresponding production qualifications and technical strength to enter the market and win the trust of customers.
Quality certification and standards: In order to ensure that the quality and performance of products meet relevant standards and requirements, enterprises need to obtain corresponding quality certification and standard certification. The acquisition of these certifications and standards requires enterprises to invest a lot of time and energy in research and development and testing.
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