The grain growth of tungsten wire at high temperature for a long time will have a series of significant effects, which are directly related to the performance and life of tungsten wire. The following is a detailed analysis of these effects:
- Changes in mechanical properties
Decrease in hardness and toughness:
After the grains grow, the hardness of the tungsten wire will be significantly reduced, which means that the ability of the tungsten wire to resist external scratches or pressure into its surface is weakened.
At the same time, the toughness will also decrease, that is, the tungsten wire is more likely to break when subjected to external forces.
Decrease in tensile strength:
The growth of grains leads to a decrease in the number of grain boundaries inside the tungsten wire. The grain boundary is a weak link in the material and has an important impact on the strength of the material.
The reduction in the number of grain boundaries reduces the overall tensile strength of the tungsten wire and makes it more likely to break when subjected to tension.
- Changes in physical properties
Changes in conductive properties:
Grain growth may cause changes in the electron channel inside the tungsten wire, thereby affecting its conductive properties.
Generally speaking, grain growth may lead to an increase in resistivity and a decrease in conductive properties.
Changes in thermal conductivity:
Grain growth may also affect the thermal conductivity of tungsten wire, that is, the ability of the material to conduct heat.
The change in thermal conductivity may vary depending on the degree and mode of grain growth, but it usually leads to a decrease in the efficiency of heat conduction.
- Changes in microstructure
Grain size increase:
Under long-term high temperature, the grains inside the tungsten wire will continue to grow, resulting in a significant increase in grain size.
The increase in grain size may make the microstructure inside the tungsten wire uneven, thereby affecting its overall performance.
Grain boundary migration and merging:
As the grains grow, grain boundary migration and merging will occur between adjacent grains.
This may lead to a decrease in the number of grain boundaries inside the tungsten wire and changes in the grain boundary structure, further affecting the performance of the tungsten wire.
- Impact on service life
Accelerated aging:
The changes in mechanical properties, physical properties and microstructure caused by grain growth will accelerate the aging process of tungsten wire.
Aged tungsten wire is more susceptible to external environmental influences, such as oxidation, corrosion, etc., thereby shortening its service life.
Increase the risk of fracture: Due to the decrease in hardness and toughness and the decrease in tensile strength caused by grain growth, tungsten wire is more likely to break when subjected to external force. This will not only affect the normal operation of the equipment, but may also cause safety hazards.
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