Molybdenum foil used in electronics is characterized by high purity (≥99.95%), excellent surface quality, and specific physical properties, meeting demands for semiconductor and electronic device manufacturing. High purity, achieved via electron beam melting, keeps impurities (e.g., carbon, oxygen) below 50 ppm, ensuring low defect rates and chemical stability. Physical properties include a density of 10.28 g/cm³, tensile strength of 500-700 MPa, hardness of 150-200 HV, and moderate ductility (elongation 10-20%). A key feature is its low thermal expansion coefficient (4.8 × 10⁻⁶/K), close to silicon’s (2.6 × 10⁻⁶/K), minimizing thermal stress, ideal for substrates or lead frames. Good thermal conductivity (138 W/m·K) and electrical conductivity (1.87 × 10⁷ S/m) support efficient heat management and current transmission. The surface is smooth (polished, roughness Ra<0.1 μm), facilitating thin-film deposition, such as sputtering targets for chip or display coatings. Chemically, it resists dilute acids and alkalis at room temperature but requires vacuum protection above 600°C due to oxidation. Applications include semiconductor substrates, sputtering targets, and X-ray tube anodes, demanding high-precision machining and strict quality control. Advantages include stable performance and thermal compatibility; disadvantages are high cost and oxidation sensitivity. Testing involves spectral analysis and surface morphology to meet electronics industry standards.
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