Is Hot Isostatic Pressing (Hip) Common in Molybdenum Crucible Manufacturing?

Hot isostatic pressing (HIP) is common in the manufacture of molybdenum crucibles, especially in high-end applications. The following is a specific analysis:

  1. Application of HIP in the manufacture of molybdenum crucible

Improve density and performance

The HIP process uses high temperature and high pressure simultaneously to make the relative density of the molybdenum crucible reach more than 99%, significantly improving the wear resistance, corrosion resistance and mechanical properties of the material.

For example, in a sapphire single crystal growth furnace, the molybdenum crucible after HIP treatment can withstand higher temperatures (such as above 2000°C) and extend its service life.

Eliminate internal defects

HIP can seal the pores and cracks inside the molybdenum crucible, making it reach the theoretical density and reducing the risk of material failure during use.

This is especially important for high-demand fields such as nuclear fusion devices, aerospace, etc.

Complex shape preparation

The HIP process is suitable for manufacturing special-shaped or large-sized molybdenum crucibles to meet special application requirements.

  1. HIP process parameters

Temperature: usually in the range of 1800-2200℃.

Pressure: can reach 100-200MPa.

Gas medium: Argon is commonly used because of its inertness and low thermal conductivity, which is conducive to temperature uniformity.

  1. Advantages of HIP in Molybdenum Crucible Manufacturing

Material performance optimization

molybdenum crucible after HIP treatment can be increased by 10-100 times, and it is suitable for high stress and high temperature environments.

Cost-effectiveness

Although HIP equipment investment is relatively high, it can reduce overall costs by reducing scrap rates and extending service life.

Process compatibility

HIP can be combined with other processes (such as powder metallurgy and forging) to further improve the performance of molybdenum crucibles.

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