Molybdenum crucible plays a key role in material support and process guarantee in semiconductor manufacturing, especially in extreme environments such as high temperature, high vacuum and chemical corrosion, where their performance directly determines the quality and reliability of semiconductor devices. The following is a detailed description from three aspects: core functions, technical advantages and application scenarios:
- Core Functions
High temperature material melting and purification
Function: Used to smelt high- purity metals (such as tungsten, molybdenum, tantalum, etc.) and compounds (such as silicide, nitride) to provide ultra-high purity source materials for semiconductor thin film deposition.
Advantages: Molybdenum crucible has a high melting point (2610°C) and high temperature oxidation resistance, can withstand extreme temperatures above 2000°C, and avoid the introduction of impurities.
Core components of the thermal field of the single crystal growth furnace
Function: As the thermal field component of the growth furnace of sapphire single crystal, silicon carbide single crystal, etc., it carries the melt and maintains the temperature gradient.
Advantages: Molybdenum ’s low coefficient of thermal expansion (5.5×10⁻⁶ / ° C) and high thermal conductivity ensure temperature uniformity and reduce crystal defects.
Chemical Vapor Deposition (CVD) Reactor Chamber
Function: As a reaction vessel for CVD equipment, it carries high-temperature gas reactions and deposits thin film materials (such as gallium nitride and hafnium oxide).
Advantages: The chemical inertness of molybdenum prevents reaction with reactive gases and ensures the purity of the film.
- Technical advantages
Performance Indicators | Molybdenum crucible characteristics | Contribution to semiconductor manufacturing |
purity | ≥99.95% | Avoid metal impurity contamination and improve device yield |
High temperature stability | 2610℃ melting point, 2000℃ long-term use | Meet the requirements of high temperature processes such as epitaxial growth and annealing |
Thermal expansion matching | to SiC (4.4×10 ⁻⁶ / ℃) | Reduce thermal stress and avoid thermal shock cracking |
Corrosion resistance | Molten metal corrosion resistance | Suitable for metal smelting and chemically corrosive environments |
Mechanical strength | Tensile strength ≥ 600MPa | Withstand thermal pressure and mechanical vibration |
- Application Scenarios
Power semiconductor devices
Application: Epitaxial growth of silicon carbide (SiC) power devices.
Requirements: Molybdenum crucibles need to withstand temperatures above 2000°C to maintain the temperature gradient of the SiC melt and ensure the uniformity of the epitaxial layer.
Optoelectronic devices
Application: Sapphire-based LED chip manufacturing.
Demand: As a thermal field component of a single crystal growth furnace, molybdenum crucibles must have high purity and low thermal expansion properties to reduce crystal dislocations.
Advanced Packaging
Application: melting of tungsten-copper alloy bonding materials.
Requirements: Molybdenum crucibles need to be resistant to high temperature oxidation to avoid the introduction of oxygen impurities that affect the bonding strength.
- Case Comparison
Application Areas | Traditional Materials | Molybdenum crucible advantages | Typical indicator improvement |
SiC epitaxial growth | Graphite Crucible | High temperature oxidation resistance, low thermal expansion, high purity | Crystal defect density reduced by 30%, yield increased by 15% |
Sapphire single crystal growth | Tungsten Crucible | Lower cost and better processability | Crystal diameter expanded to 8 inches, cost reduced by 20% |
Metal smelting | Alumina Crucible | Resistant to molten metal corrosion, high strength at high temperature | Metal purity increased to 99.9999% |
- Technical Challenges and Solutions
Oxidation Problem
Challenge: At high temperatures, the molybdenum surface oxidizes to generate MoO₃, which volatilizes and causes material loss.
Solution:
Surface coating technology (such as Mo₂C, ZrO₂ coating);
Vacuum or inert gas (such as Ar) protection.
Mechanical deformation
Challenge: Long-term high-temperature use causes the crucible to deform, affecting the uniformity of the thermal field.
Solution:
Optimize the crucible structure design (such as adding reinforcing ribs);
with high density (≥ 10.2g /cm³) molybdenum powder.
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