Table of contents
Chapter 1 Introduction
1.1 Understanding Heat Sink Materials
1.1.1 Definition and function of heat sink materials
1.1.2 The key role of heat sink materials in electronic systems
1.2 Basic Introduction of Tungsten Copper Heat Sink
1.2.1 Component ratio of common tungsten copper heat sink
1.2.2 Microstructure of Tungsten Copper Heat Sink
1.2.3 Analysis of the bonding mechanism of tungsten and copper at the atomic level
1.3 Basic properties of tungsten copper heat sink
1.4 Development History and Current Status of Tungsten Copper Heat Sink
1.4.1 Development of Tungsten Copper Heat Sink
1.4.2 Key technological breakthroughs in different periods
1.4.3 Application Status and Development Prospects of Tungsten Copper Heat Sink
Chapter 2 Performance of Tungsten Copper Heat Sink
2.1 Thermal conductivity of tungsten copper heat sink
2.1.1 Thermal conductivity mechanism of tungsten copper heat sink
2.1.2 Factors affecting thermal conductivity of tungsten copper heat sink
2.1.2.1 Effect of composition on thermal conductivity of tungsten copper heat sink
2.1.2.2 Effect of structure on thermal conductivity of tungsten copper heat sink
2.1.2.3 Effect of impurities on thermal conductivity of tungsten copper heat sink
2.1.3 Test method for thermal conductivity of tungsten copper heat sink
2.1.4 How to improve the thermal conductivity of tungsten copper heat sink
2.2 Control of thermal expansion coefficient of tungsten copper heat sink
2.2.1 Principle of Thermal Expansion Coefficient of Tungsten Copper Heat Sink
2.2.2 Effect of Tungsten-Copper Ratio on Thermal Expansion Coefficient
2.2.3 Test method for thermal expansion coefficient of tungsten copper heat sink
2.2.3 Methods and strategies for achieving accurate thermal expansion coefficient matching
2.3 Mechanical properties of tungsten copper heat sink
2.3.1 Strength of tungsten copper heat sink and its test method
2.3.2 Hardness of Tungsten Copper Heat Sink and Its Test Method
2.3.3 Toughness of tungsten copper heat sink and its test method
2.3.4 Ductility of Tungsten Copper Heat Sink and Its Test Method
2.3.5 Correlation between mechanical and thermal properties of tungsten copper heat sink
2.4 Electrical conductivity and other properties of tungsten copper heat sink
2.4.1 Electrical conductivity of tungsten copper heat sink and its test method
2.4.2 Oxidation resistance of tungsten copper heat sink and its test method
2.4.3 Corrosion resistance and other performance characteristics of tungsten copper heat sink
2.5 CTIA GROUP LTD tungsten copper heat sink MSDS
Chapter 3 Classification of Tungsten Copper Heat Sinks
3.1 Classification of Tungsten Copper Heat Sinks by Composition Ratio
3.1.1 Performance and application of W90Cu10
3.1.2 Performance and application of W85Cu15
3.1.3 Performance and application of W80Cu20
3.1.4 Performance and application of W75Cu25
3.1.5 Performance and application of W50Cu50
3.1.6 Performance comparison of different tungsten-copper composition ratios
3.2 Classification of Tungsten Copper Heat Sinks by Manufacturing Process
3.2.1 Preparation of tungsten copper heat sink by powder metallurgy
3.2.2 Preparation of tungsten copper heat sink by infiltration method
3.2.3 Other new preparation processes (such as hot pressing sintering, plasma spraying)
3.3 Classification of Tungsten Copper Heat Sinks by Application Field
3.3.1 Tungsten copper heat sink for electronic packaging
3.3.2 Tungsten copper heat sink for aerospace applications
3.3.3 Tungsten copper heat sink for industrial thermal management
3.3.4 Tungsten copper heat sink for laser heating
3.3.5 Other special purpose tungsten copper heat sinks
Chapter 4 Preparation Technology of Tungsten Copper Heat Sink
4.1 Traditional preparation process of tungsten copper heat sink
4.1.1 Powder Metallurgy (Principle, Process and Key Steps)
4.1.2 Infiltration method (process and advantages and disadvantages analysis)
4.1.3 Technical points of high temperature liquid phase sintering
4.2 Modern innovative technology of tungsten copper heat sink
4.2.1 Principles and advantages of hot isostatic pressing
4.2.2 Introduction to Spark Plasma Sintering Technology
4.2.3 Other emerging technologies such as 3D printing technology
4.3 Process comparison and selection of tungsten copper heat sink
4.3.1 Differences in the effects of different preparation processes on material properties
4.3.2 Considerations for selecting an appropriate preparation process based on application requirements
4.3.3 Cost analysis and optimization strategy of preparation process
4.4 Quality Control and Inspection of Tungsten Copper Heat Sink
4.4.1 Key links in material quality control
4.4.2 Material performance testing methods and standards
4.4.3 Defect analysis and improvement measures of tungsten copper heat sink
Chapter 5 Application of Tungsten Copper Heat Sink in Electronic Information Field
5.1 Heat Dissipation of Semiconductor Devices
5.1.1 Heat Dissipation Challenges of Power Semiconductor Chips
5.1.2 Application of Tungsten Copper Heat Sink in Chip Heat Dissipation
5.1.3 Performance comparison between tungsten copper heat sink and other heat dissipation materials
5.2 Integrated Circuit Packaging
5.2.1 Requirements for heat sink materials in integrated circuit packaging
5.2.2 Application of tungsten copper heat sink in different packaging forms
5.2.3 Mechanism of improving integrated circuit performance by tungsten copper heat sink
5.3 Communication Equipment Heat Dissipation
5.3.1 Characteristics of heat dissipation requirements for 5G communication base station equipment
5.3.2 Application of Tungsten Copper Heat Sink in Communication Module
5.3.3 Tungsten copper heat sink supports the development of miniaturization and high efficiency of communication equipment
5.4 Application of Tungsten Copper Heat Sink in Other Electronic Devices
5.4.1 Application in Computer CPU Cooling Solutions
5.4.2 Exploration of potential applications in consumer electronics
Chapter 6 Application of Tungsten Copper Heat Sink in Energy and Power Industry
6.1 Heat dissipation of power electronic devices
6.1.1 Heating Problems of Power Electronic Devices Such as Thyristors and IGBTs
6.1.2 Application of Tungsten Copper Heat Sink in Power Electronics Devices
6.1.3 Contribution of Tungsten Copper Heat Sink to Improving Power System Stability and Efficiency
6.2 New energy power generation equipment
6.2.1 Heat dissipation requirements of solar photovoltaic inverters
6.2.2 Application of Tungsten Copper Heat Sink in Wind Turbine Converter
6.2.3 The significance of tungsten copper heat sink in the development of new energy industry
6.3 Heat dissipation of energy storage system
6.3.1 Thermal Management Challenges of Lithium Battery Energy Storage Systems
6.3.2 Application of Tungsten Copper Heat Sink in Energy Storage Battery Heat Dissipation
6.3.3 The role of tungsten copper heat sink in improving the performance of energy storage system
Chapter 7 Application of Tungsten Copper Heat Sink in Aerospace Field
7.1 Aircraft Electronic Equipment Heat Dissipation
7.1.1 Heat dissipation problems of avionics equipment in complex environments
7.1.2 Application of Tungsten Copper Heat Sink in Aircraft Avionics System
7.1.3 Tungsten copper heat sink meets the requirements of lightweight and high performance in the aviation field
7.2 Satellite and Spacecraft Thermal Control
7.2.1 Working Principle and Requirements of Satellite Thermal Control System
7.2.2 Application of Tungsten Copper Heat Sink in Satellite Electronic Equipment
7.2.3 Application of Tungsten Copper Heat Sink in Satellite Energy System
7.2.4 The importance of tungsten copper heat sinks in ensuring long-term stable operation of spacecraft
7.3 Performance of Tungsten Copper Heat Sink in Special Environments
7.3.1 Effect of high temperature on tungsten copper heat sink
7.3.2 Effect of Low Temperature on Tungsten Copper Heat Sink
7.3.3 Effect of Radiation on Tungsten Copper Heat Sink
7.3.4 Study on the Stability of Tungsten Copper Heat Sink in Extreme Environments
7.3.5 Optimization strategy of tungsten copper heat sink for extreme environment
Chapter 8 Application of Tungsten Copper Heat Sink in Other Fields
8.1 Application of Tungsten Copper Heat Sink in Medical Equipment
8.1.1 Heat dissipation requirements of medical imaging equipment
8.1.2 Application of Tungsten Copper Heat Sink in Medical Laser Equipment
8.1.3 The role of tungsten copper heat sink in improving the performance of medical equipment
8.2 Application of Tungsten Copper Heat Sink in Industrial Manufacturing
8.2.1 Application of Electrode Materials in EDM
8.2.2 Exploration of potential applications in mold manufacturing
Chapter 9 Development Prospects of Tungsten Copper Heat Sink
9.1 Research and Development Direction of New Tungsten Copper Heat Sink
9.1.1 Gradient structure design and process innovation
9.1.2 Nanocomposite reinforcement and interface engineering
9.1.3 Multifunctional integrated design
9.2 Integration and development of tungsten copper heat sink and emerging technologies
9.2.1 AI-driven material genetic engineering
9.2.2 Internet of Things and Intelligent Thermal Management System
9.3 Market Demand and Industry Prospects of Tungsten Copper Heat Sink
9.4 Regional Competition Landscape of Tungsten Copper Heat Sink
9.4.1 Asia-Pacific Dominance (Capacity Proportion of China and Japan)
9.4.2 European and American technical barriers and domestic substitution goals
9.5 Challenges and Solutions of Tungsten Copper Heat Sink
9.5.1 Cost Control Strategy
9.5.2 Performance Improvement Direction
Chapter 10 Standards and Specifications for Tungsten Copper Heat Sinks
10.1 China National Standard for Tungsten Copper Heat Sink
10.2 International Standards for Tungsten Copper Heat Sinks
10.3 Tungsten Copper Heat Sink Standards in Europe, America, Japan, South Korea and other countries around the world
appendix:
Tungsten Copper Heat Sink Glossary
References
Chapter 1: Introduction
1.1 Understanding Heat Sink Materials
1.1.1 Definition and function of heat sink materials
Heat sink material refers to a class of materials with high thermal conductivity, appropriate thermal expansion coefficient and good mechanical properties, which are used to absorb, conduct and dissipate the heat generated during the operation of electronic devices or other equipment to maintain the equipment within a safe operating temperature range. Its main function is to transfer heat from high temperature areas (such as chips or power modules) to low temperature areas (such as the environment or cooling system) through efficient heat conduction and thermal radiation, thereby preventing the device from overheating and causing performance degradation or failure. Heat sink materials usually have high thermal conductivity (for example, the thermal conductivity of copper is about 401 W/m·K, and that of molybdenum-copper alloy is about 150-270 W/m·K), can transfer heat quickly, and need to match the thermal expansion coefficient of electronic components to reduce thermal stress. For example, molybdenum-copper sheets (such as Mo70Cu30) are highly compatible with ceramic substrates (such as aluminum nitride) due to their adjustable thermal expansion coefficient (about 8-10×10 ⁻⁶ /K), and are often used as heat dissipation substrates for 5G communication equipment. Another important role of heat sink materials is to improve the long-term reliability of the system and reduce the aging rate of devices through effective thermal management. For example, in the power module of electric vehicles, heat sink materials ensure the stability of batteries and inverters under high loads and extend the life of the equipment. In addition, heat sink materials must also have good processability and corrosion resistance to adapt to complex manufacturing processes and various working environments, such as high temperature and vibration conditions in aerospace equipment.
The role of heat sink materials is not limited to heat management, but also includes structural support and electrical performance optimization. In some applications, heat sink materials need to be conductive. For example, molybdenum copper sheets are used as both heat dissipation substrates and conductive components in high-frequency electronic devices, and their conductivity can reach 30-40% IACS (International Annealed Copper Standard). The choice of heat sink materials directly affects the performance, cost and reliability of the equipment. For example, in the field of optoelectronics, high-power lasers use heat sink materials (such as Mo60Cu40) to manage thermal loads and ensure the stability of the laser wavelength. Overall, heat sink materials support the efficient operation of modern electronic systems by optimizing thermal, electrical and mechanical properties, and are the key to achieving miniaturization and high power of high-performance equipment.
1.1.2 The key role of heat sink materials in electronic systems
Heat sink materials play a key role in electronic systems, as the high performance, miniaturization and high power density of electronic devices have led to a sharp increase in the demand for thermal management. As Moore’s Law drives chip integration, the power density of modern electronic devices (such as CPUs, GPUs and power semiconductors) has increased significantly, generating a lot of heat. For example, the RF power amplifier of a 5G base station will generate high heat loads during high-frequency operation. If the heat is not effectively dissipated through heat sink materials, it may cause device performance degradation or permanent damage. Heat sink materials quickly conduct heat to maintain the operating temperature of the device within a safe range (usually below 100-150°C, depending on the device type), ensuring efficient operation and long-term reliability of the system. For example, molybdenum copper sheets are widely used as heat sinks in 5G communication equipment due to their high thermal conductivity and thermal expansion matching with ceramic substrates to ensure the stability of signal transmission.
READ MORE: What Is Tungsten Copper Heat Sink
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