The thermal conductivity of tungsten-nickel-iron alloy is an important part of its thermal properties, usually measured by thermal conductivity, which is generally between 50 – 80 W/(m·K). The specific value varies with the alloy composition, microstructure and preparation process. Thermal conductivity reflects the ability of a material to transfer heat. A higher thermal conductivity means that the material can transfer heat from high-temperature areas to low-temperature areas more quickly, thus avoiding performance degradation caused by local overheating.
From the perspective of composition, tungsten has a high thermal conductivity (the thermal conductivity of pure tungsten at room temperature is about 173 W/(m·K)), while nickel (about 90 W/(m·K)) and iron (about 80 W/(m·K)) have medium thermal conductivity, although lower than that of tungsten. In tungsten-nickel-iron alloy, tungsten particles, as the main channel for heat conduction, provide a good basis for the thermal conductivity of the alloy due to their high content; the nickel-iron binding phase forms a continuous heat conduction network by filling the gaps between tungsten particles, ensuring that heat can be efficiently transferred inside the alloy. When the tungsten content increases, the thermal conductivity of the alloy will increase accordingly, because more tungsten particles can reduce the resistance in the heat transfer process; the change of nickel-iron content has a relatively small impact on thermal conductivity, but an excessively high proportion of nickel-iron may slightly reduce the overall thermal conductivity due to the limitation of the thermal conductivity of the binding phase itself.
The microstructure also has a significant impact on thermal conductivity. Tungsten-nickel-iron alloy prepared by powder metallurgy technology, if fully sintered, has high density, few internal pores, and tight interface bonding between tungsten particles and the binding phase, will reduce scattering and loss during heat transfer, resulting in better thermal conductivity. Conversely, if there are many pores or poor interface bonding in the alloy, it will hinder heat transfer and reduce thermal conductivity. Therefore, optimizing process parameters such as sintering temperature and holding time to improve the density of the alloy is an important means to enhance its thermal conductivity.
In practical applications, the thermal conductivity of tungsten-nickel-iron alloy enables it to play an important role in many fields. For example, in electronic equipment, it can be used as a heat dissipation component to quickly 导出 the heat generated by the chip during operation, ensuring the stable operation of the equipment; in high-temperature components in the aerospace field, good thermal conductivity can help distribute heat evenly, reducing thermal stress caused by excessive local temperature difference; in radiation shielding components in the nuclear industry, thermal conductivity helps to timely dissipate the absorbed radiation heat, avoiding material aging due to long-term high temperature. In addition, combined with its high density and high temperature resistance, the alloy shows irreplaceable advantages in scenarios that need to meet both heat dissipation and structural support.
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