The primary application of black tungsten wire in the photovoltaic industry is as a substrate for diamond wire saws used in silicon wafer cutting. Specifically, black tungsten wire, with its high strength, wear resistance, and small diameter, is employed as a cutting wire to slice silicon ingots into thin wafers for manufacturing solar panels. Its main advantages include:
- High Precision and Efficiency: The high strength and wear resistance of black tungsten wire ensure it does not break easily during cutting, meeting the demands of high-precision and high-efficiency production. It enables the cutting of thinner wafers, reducing silicon material waste and lowering production costs.
- Trend Toward Thinner and Larger Wafers: As the photovoltaic industry moves toward thinner and larger silicon wafers, black tungsten wire, which can be processed to extremely fine diameters (e.g., 28μm or 30μm) and offers greater strength than traditional high-carbon steel wire, has become the preferred alternative for diamond wire substrates. This helps increase wafer yield and reduce costs.
- Corrosion Resistance: Black tungsten wire exhibits high corrosion resistance in acidic environments (e.g., sulfuric or hydrochloric acid), preventing wire breakage due to acid corrosion during cutting and enhancing production stability.
- Long Lifespan: Compared to high-carbon steel wire, tungsten-based cutting wire has a significantly longer lifespan (e.g., over 40 cutting cycles compared to 2–4 cycles for steel wire), reducing material replacement frequency and costs.
More details of tungsten wire, please visit website: http://www.tungsten-wire.com.cn/
Please contact CHINATUNGSTEN for inquiry and order of tungsten wire:
Email: sales@chinatungsten.com
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