Black tungsten wire is primarily used in semiconductor manufacturing in the following areas:
- Thin Film Deposition (CVD/ALD Processes): Black tungsten wire is commonly used in chemical vapor deposition (CVD) or atomic layer deposition (ALD) equipment as a heating element or filament. Its high melting point (approximately 3422°C) and excellent thermal stability make it suitable for catalyzing or decomposing precursor gases in high-temperature environments, forming semiconductor thin films such as silicon, oxides, or metal layers.
- Thermal Evaporation Coating: In physical vapor deposition (PVD), black tungsten wire serves as an evaporation source, heating and vaporizing metals or other materials to deposit conductive or contact layers onto semiconductor substrates.
- High-Temperature Annealing: Tungsten wire is used in annealing furnaces to provide a high-temperature environment, improving the crystal structure of semiconductor materials or activating dopants.
- Plasma Generation: In certain plasma-enhanced processes, black tungsten wire can be used to generate or sustain a plasma environment, assisting in etching or deposition processes.
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