To prevent brittle fracture in cleaned tungsten wire, the following measures can be taken:
- Temperature Control: Maintain appropriate temperatures (approximately 1400–1600°C) during swaging and drawing to avoid low-temperature brittleness.
- Multiple Annealing: Perform regular annealing (1000–1200°C) during the drawing process to relieve work hardening and internal stresses.
- Doping Optimization: Use appropriate doping (e.g., potassium or rare earth elements) to improve tungsten ductility and reduce grain boundary embrittlement.
- Die Optimization: Employ smooth, high-precision wire drawing dies to minimize surface defects that trigger cracks.
- Lubricant Application: Use high-temperature lubricants (e.g., graphite-based lubricants) during drawing to reduce friction.
- Environment Control: Conduct processing in a hydrogen or vacuum environment to prevent surface embrittlement caused by oxidation.
- Quality Inspection: Detect internal defects in tungsten wire using ultrasound or microscopy and promptly remove non-conforming products.
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