Cleaned tungsten wire offers significant advantages in photovoltaic diamond wire (used for silicon wafer cutting), gradually replacing traditional high-carbon steel wire and becoming the preferred material for high-efficiency wafer cutting:
- Ultra-High Strength: The tensile strength of cleaned tungsten wire far exceeds that of high-carbon steel wire (over 4000 MPa), enabling it to withstand high tension, ensuring stability when cutting large-sized and ultra-thin silicon wafers, and reducing the risk of wire breakage.
- Extremely Fine Diameter: Cleaned tungsten wire can be drawn to ultra-fine diameters (mass production at 26–35 μm, with R&D targeting even lower), significantly reducing cutting loss, increasing wafer yield, and lowering photovoltaic cell production costs.
- Excellent Wear Resistance: With high hardness (Mohs hardness ~7.5), combined with electroplated or sintered diamond particles, it delivers superior cutting performance and strong wear resistance, extending the service life of diamond wire.
- Chemical Stability: Cleaned tungsten wire exhibits excellent corrosion resistance when in contact with coolant and silicon debris during cutting, maintaining stable performance.
- Thermal Stability: Localized high temperatures generated during cutting do not affect the mechanical properties of cleaned tungsten wire, ensuring high-precision cutting.
- Economic Benefits: With ongoing optimization of production processes, the cost of cleaned tungsten wire diamond wire continues to decrease, offering a cost-performance ratio that is approaching or surpassing that of steel wire, with rapidly increasing market penetration.
These advantages make cleaned tungsten wire diamond wire a key material driving the photovoltaic industry toward high-efficiency, ultra-thin wafer production.
More details of tungsten wire, please visit website: http://www.tungsten-wire.com.cn/
Please contact CHINATUNGSTEN for inquiry and order of tungsten wire:
Email: sales@chinatungsten.com
Tel.: +86 592 5129595
