LED ejecting needle is an equipment component used in the LED die bonding process. In the die bonding process, pogo pins are used to fix the LED chip on the substrate. It has a unique spring design that provides uniform support and ensures good contact between the LED chip and the substrate. This ejecting needle also offers high precision and durability, allowing it to maintain good performance over repeated use.
More details of tungsten needles, please visit website: http://tungsten.com.cn/tungsten-needles-and-pins.html
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