What Are the Precautions When Using Tungsten Probe Card?

When using tungsten probe cards for wafer testing, you need to pay attention to the following:

1. Correct installation: Before use, the tungsten probe card needs to be installed correctly on the test instrument to ensure that the card and the instrument are well connected to avoid problems such as poor signal transmission or poor contact.

2. Handle with caution: During use, you need to handle the tungsten probe card carefully to avoid collision or scratching the wafer under test or the tungsten probe itself. At the same time, keep the card clean and dry to avoid adverse effects on the test results.

3. Regular inspection: After use, it is necessary to regularly check whether the tungsten probe of the tungsten probe card is worn or deformed. If it is damaged, it should be replaced in time. At the same time, check whether the test circuit board is working properly to ensure the stability and accuracy of signal transmission.

4. Cleaning and maintenance: Before and after use, the tungsten probe card needs to be cleaned and maintained to keep the card clean and in good condition. Special cleaning agents and maintenance agents can be used for cleaning and maintenance.

5. Safety protection: During use, you need to pay attention to safety protection measures, such as wearing gloves, goggles, etc., to avoid injury. At the same time, avoid contact with toxic and harmful substances to ensure personal safety.

In short, the tungsten probe card is a special equipment used for semiconductor wafer testing. It consists of a tungsten probe and a test circuit board. It is mainly used to test the electrical properties of the wafer. When using, you need to pay attention to matters such as correct installation, careful operation, regular inspection, cleaning and maintenance, and safety protection. By using tungsten probe cards for wafer testing, accurate test data and reliable test results can be obtained, providing important technical support for quality control and optimization of semiconductor manufacturing.

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