The key technologies for tungsten alloy 3D printing packaging wafers include the following links:
- Powder preparation: The preparation of tungsten alloy powder is the prerequisite for manufacturing tungsten alloy 3D printing packaging chips. The particle size, particle size distribution, purity, etc. of the powder have an important impact on the subsequent printing process and the performance of the encapsulated chip. In order to obtain tungsten alloy powder suitable for printing, grinding, screening, impurity removal and other processes are required.
- Printing process: The printing process of tungsten alloy powder is the core technology for manufacturing tungsten alloy 3D printed packaging chips. Tungsten alloy has the characteristics of high melting point and low vapor pressure, and is prone to clogging or oxidation during the printing process. Therefore, it is necessary to select appropriate printing parameters, such as laser power, scanning speed, powder layer thickness, etc., to obtain high-quality printed packaging sheets.
- Sintering process: Sintering is an important link in the manufacturing process of tungsten alloy 3D printed packaging chips. Through sintering, the printed structure can be densified, increasing its strength and hardness. At the same time, parameters such as temperature, time, and atmosphere during the sintering process also need to be precisely controlled to ensure that the sintered package chips have excellent performance.
- Post-processing process: Post-processing process is an important step to improve the performance of tungsten alloy 3D printed packaging sheets. Post-processing includes heat treatment, surface treatment, mechanical processing, etc. Through post-processing, the microstructure and performance of the package wafer can be further optimized to meet the use requirements of different fields and products.
- Reliability evaluation: In the process of manufacturing tungsten alloy 3D printed packaging chips, reliability evaluation needs to be carried out to ensure that it can meet the usage requirements. Reliability evaluation includes mechanical performance testing, thermal performance testing, chemical performance testing, etc. Through these tests, the performance of the package can be comprehensively evaluated, and potential problems can be discovered and solved in a timely manner.
In short, the key technologies for tungsten alloy 3D printing packaging chips involve powder preparation, printing process, sintering process, post-processing process and reliability evaluation. Only by mastering these key technologies can we produce tungsten alloy 3D printed packaging chips with excellent performance and reliability to meet the requirements of different fields and products.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
