The application of 90WMoNiFe alloy in the electronic field is mainly reflected in the following aspects:
vacuum electronics
Tungsten-molybdenum alloy is widely used in vacuum electronic devices due to its excellent mechanical properties and high temperature resistance. For example, it can be used to make components such as electrodes, heaters and vacuum windows. These components need to withstand high current densities and arc erosion, and tungsten-molybdenum alloy thermal inserts can resist these conditions and ensure stable operation of the equipment.
Semiconductors and integrated circuits
Tungsten and molybdenum are both important materials in the electronics industry. Tungsten wire can be used to make heating elements in high-temperature furnaces, while molybdenum sheets can be used to make substrates for integrated circuits. These applications benefit from their high temperature stability and good electrical conductivity.
Electronic packaging materials
Tungsten nickel-iron alloy has high thermal conductivity and low thermal expansion coefficient, making it an ideal electronic packaging material. It can protect electronic components from thermal expansion and temperature changes, improving the reliability and stability of electronic components.
The application of 90WMoNiFe alloy in the electronic field mainly benefits from its excellent mechanical properties, high temperature stability and good electrical conductivity. With the continuous advancement of electronic technology, the application of this alloy in the electronic field will also be further expanded.
More details of tungsten alloy product, please visit website: http://tungsten-alloy.com/
Please contact CHINATUNGSTEN for inquiry and order of tungsten alloy:
Email: sales@chinatungsten.com
Tel.: 86 592 5129595
