Tungsten silver base plate is a composite material composed of tungsten and silver, mainly used for the encapsulation of electronic equipment. It has high thermal conductivity, high electrical conductivity, high strength and good toughness, and can quickly conduct the heat generated by electronic components while meeting the electrical connection requirements of electronic components. Tungsten silver base plate also has good corrosion resistance and oxidation resistance, and can be used for a long time in harsh environments without damage. In addition, tungsten silver base plate is also easy to process and manufacture. It can be manufactured by powder metallurgy process, and the shape and size can also be precisely controlled by processing and manufacturing process. Therefore, tungsten silver base plate has broad application prospects and market potential in the field of electronic component packaging.
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