1. High thermal conductivity
Tungsten silver base plate has high thermal conductivity and can quickly conduct away the heat generated by electronic components. Compared with traditional pure copper packaging materials, tungsten silver base plate has higher thermal conductivity, which can more effectively reduce the operating temperature of electronic components and improve their stability and reliability. According to relevant data, the thermal conductivity of tungsten silver base plate can reach more than several times that of pure copper.
2. High electrical conductivity
Tungsten silver base plate also has high electrical conductivity, which can meet the electrical connection requirements of electronic components. This good electrical property enables tungsten silver base plate to adapt to the electrical connection requirements of various electronic equipment and ensure the normal operation of electronic components. Compared with pure copper, the electrical conductivity of tungsten silver base plate is also relatively high.
3. High strength and good toughness
Tungsten silver base plate has high strength and good toughness, which can withstand various stresses generated by electronic components during operation and ensure the stability and reliability of components. The strength and toughness of this material enable it to adapt to various complex working environments and ensure the performance and reliability of electronic components.
4. Good corrosion resistance
Tungsten silver base plate has good corrosion resistance and can be used for a long time in harsh environments without damage. This corrosion resistance enables the tungsten silver base plate to adapt to various complex working environments and ensure the stability and reliability of electronic components. Compared with pure copper, the corrosion resistance of tungsten silver base plate has also been significantly improved.
5. Easy to process and manufacture
Tungsten silver base plate can be manufactured by powder metallurgy process and has the characteristics of easy processing and manufacturing. This easy processing and manufacturing feature enables tungsten silver base plate to meet the needs of large-scale production while reducing production costs. In addition, the shape and size of tungsten silver base plate can also be precisely controlled through processing and manufacturing processes to meet various different application requirements.
More details of Tungsten Copper Heat Sinks, please visit website: http://tungsten-copper.com/Tungsten-Copper-Heat-Sink.html
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