What Are the Characteristics of Wafer Tungsten Rhenium Probe Card?

1. High density: Wafer tungsten rhenium probe card is made of high-density tungsten alloy material, with high density, which is conducive to improving the accuracy and stability of the test.

2. High conductivity: Wafer tungsten rhenium probe card has excellent conductivity, which can ensure the stable transmission of current and improve the accuracy and reliability of the test.

3. High temperature resistance: Wafer tungsten rhenium probe card can maintain its structural stability and conductivity in high temperature environment, and is suitable for testing and measurement in high temperature environment.

4. Wear and corrosion resistance: Wafer tungsten rhenium probe card has good wear resistance and corrosion resistance, and can maintain its accuracy and stability during long-term use.

5. High reliability: Wafer tungsten rhenium probe cards have undergone strict quality control and testing, and have high reliability and stability, which can ensure the accuracy and reliability of test results.

6. Accurate positioning and measurement: Wafer tungsten rhenium probe cards have accurate positioning and measurement functions, and can accurately test the performance parameters of chips, such as voltage, current, resistance, etc.

7. Fast and efficient: Wafer tungsten rhenium probe cards have fast and efficient testing capabilities, which can improve production efficiency and reduce costs in large-scale production.

More details of tungsten probes, please visit website: http://tungsten.com.cn/tungsten-needles-and-pins.html

Please contact CHINATUNGSTEN for inquiry and order of tungsten needles:

Email: sales@chinatungsten.com

Tel.: +86 592 5129595

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