What Is the Preparation Method of Wafer Tungsten-Rhenium Probe Cards?

1. Powder metallurgy: Powder metallurgy is one of the main methods for preparing wafer tungsten-rhenium probe cards. This method is to make tungsten powder into tungsten blanks through processes such as pressing and sintering, and then make wafer tungsten-rhenium probe cards through processes such as processing and heat treatment. The advantages of this method are high production efficiency and low cost, but the purity of the obtained wafer tungsten-rhenium probe card is low.

2. Melting method: The melting method is to heat the tungsten raw material to a molten state, and then make a tungsten ingot through refining, pouring and other processes, and finally make a wafer tungsten rhenium probe card through processing and heat treatment. The advantage of this method is that the wafer tungsten rhenium probe card has high purity and good mechanical properties, but the production efficiency is low and the cost is high.

3. Machining method: The machining method is to process tungsten rods or tungsten plates into wafer tungsten rhenium probe cards through machining methods such as turning and milling. The advantage of this method is that the wafer tungsten rhenium probe card has high precision and good surface quality, but the production efficiency is low and the cost is high.

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