In chip testing, the applications of wafer tungsten rhenium probe cards include the following aspects:
1. Wafer probing test: This is a method of testing in the early stages of the manufacturing process to detect the functionality of each chip on the wafer. In the wafer probing test, the tungsten rhenium probe card is used to contact each contact on the chip and test its electrical characteristics.
2. Wafer aging test: A method of testing in the later stages of the manufacturing process to detect the functionality of the chip after cutting, packaging and aging. In this process, the tungsten rhenium probe card is used to contact each contact on the chip and test its electrical characteristics to ensure that the chip can work properly.
3. Fault diagnosis and failure analysis: If the chip on the wafer fails or fails, the tungsten rhenium probe card can be used to diagnose the cause of the failure. By contacting the contacts on the chip, problems in the circuit, such as open circuits, short circuits, etc., can be detected. In addition, the tungsten rhenium probe card can also be used for failure analysis to determine the cause of chip failure.
4. Process control and quality assurance: Tungsten-rhenium probe cards can also be used for process control and quality assurance. By testing multiple chips on a wafer, changes in the manufacturing process can be monitored and process parameters can be adjusted in a timely manner. In addition, tungsten-rhenium probe cards can also be used to perform quality assessments on each chip to ensure that only chips that meet quality standards are packaged and sold.
In short, wafer tungsten-rhenium probe cards have a wide range of application scenarios in chip testing, playing an important role from wafer probing tests to fault diagnosis and failure analysis to process control and quality assurance.
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