The application of tungsten-nickel-iron alloy in the balance weights of lithography machine platforms is a key embodiment of its high density and high stability in the field of high-end manufacturing, directly affecting the exposure accuracy and production efficiency of lithography machines. As the core equipment for chip manufacturing, lithography machines require the motion accuracy of the workbench to reach the nanometer level. Any tiny vibration or center of gravity shift will lead to errors in chip pattern exposure. The role of the balance weight is to offset the inertial force generated during platform movement through precise counterweight, ensuring the stable operation of the platform.
Tungsten-nickel-iron alloy, with extremely high density, can provide sufficient counterweight mass in the limited platform space. By installing balance weights at the symmetric positions of the platform, it can effectively balance the torque generated by the workbench during high-speed start-stop and rapid movement, reducing vibration and displacement. Its excellent dimensional stability ensures that the shape and volume of the balance weight remain almost unchanged during long-term use and temperature changes (local heat will be generated when the lithography machine works), avoiding the impact of counterweight changes on the dynamic balance of the platform.
In the manufacturing process, these balance weights need to undergo precision processing, with dimensional tolerance controlled at the micron level. The good processability of tungsten-nickel-iron alloy enables it to meet this strict requirement, ensuring that the weight error of each balance weight is controlled within a very small range. At the same time, the alloy has strong wear resistance and fatigue resistance, can withstand the high-frequency motion impact of the platform, and maintain stable performance for a long time, providing a solid material guarantee for the lithography machine to achieve nanometer-level precision exposure technology, and indirectly promoting the development of semiconductor chips towards higher integration.
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